Type | Description |
|---|---|
Category | Connectors, Interconnects IC Sockets |
Manufacturer |
Samtec Inc. |
Series |
ICF |
Packaging |
Bulk |
Part Status |
Active |
Type |
DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) |
16 (2 x 8) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Tin |
Contact Finish Thickness - Mating |
- |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Surface Mount |
Features |
Open Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Tin |
Contact Finish Thickness - Post |
- |
Contact Material - Post |
Beryllium Copper |
Housing Material |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C ~ 125°C |
Termination Post Length |
- |
Material Flammability Rating |
- |
Contact Resistance |
- |
