Type | Description |
|---|---|
Category | Connectors, Interconnects IC Sockets |
Manufacturer |
Samtec Inc. |
Series |
APO |
Packaging |
Bulk |
Part Status |
Active |
Type |
DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) |
8 (2 x 4) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
10.0µin (0.25µm) |
Contact Material - Mating |
Phosphor Bronze |
Mounting Type |
Through Hole |
Features |
Open Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
10.0µin (0.25µm) |
Contact Material - Post |
Phosphor Bronze |
Housing Material |
Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature |
- |
Termination Post Length |
- |
Material Flammability Rating |
UL94 V-0 |
Contact Resistance |
- |
Base Product Number |
APO-308 |
