Type | Description |
|---|---|
Category | Connectors, Interconnects IC Sockets |
Manufacturer |
TE Connectivity AMP Connectors |
Series |
DMD |
Packaging |
Tray |
Part Status |
Active |
Type |
LGA |
Number of Positions or Pins (Grid) |
257 (20 x 30) |
Pitch - Mating |
0.039" (1.00mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
3.00µin (0.076µm) |
Contact Material - Mating |
Copper Alloy |
Mounting Type |
Surface Mount |
Features |
Board Guide, Open Frame |
Termination |
Solder |
Pitch - Post |
- |
Contact Finish - Post |
- |
Contact Finish Thickness - Post |
- |
Contact Material - Post |
- |
Housing Material |
Thermostic |
Operating Temperature |
-25°C ~ 100°C |
Termination Post Length |
- |
Material Flammability Rating |
UL94 V-0 |
Contact Resistance |
- |
Base Product Number |
2319757 |
